Camera device with ois function by moving an image sensor and optical instrument

ABSTRACT

A camera device including a mover comprising a first magnet; a lens; a stator including a first coil; a first substrate; a second substrate movably disposed on the first substrate; an image sensor disposed on the second substrate; a second coil disposed on the first substrate; and a second magnet disposed on the second substrate and facing the second coil is provided. The second substrate includes a coupling part coupled to the image sensor, and an extension part extending outwardly from the coupling part so that at least a portion thereof overlaps with the first substrate in the optical axis direction, and the camera device further includes a ball disposed between the first substrate and the extension part of the second substrate.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of copending application Ser. No.17/252,070, filed on Dec. 14, 2020, which is the National Phase of PCTInternational Application No. PCT/KR2019/007813, filed on Jun. 27, 2019,which claims priority under 35 U.S.C. 119(a) to Patent Applications Nos.10-2018-0075773 and 10-2018-0075774, filed in the Republic of Korea onJun. 29, 2018, all of which are hereby expressly incorporated byreference into the present application.

TECHNICAL FIELD

The present exemplary embodiment relates to a camera device and anoptical instrument

BACKGROUND ART

The following description provides background information for thepresent exemplary embodiment and does not describe the prior art.

As various portable terminals are widely spread and commonly used, andwireless Internet services has been commercialized, the demands ofconsumer related to portable terminals have been diversified and variouskinds of additional devices have been installed in portable terminals.

Among them, there is a camera apparatus for photographing a subject as aphotograph or a moving picture. Meanwhile, in recent camera devices, anautofocus function that automatically adjusts focus according to thedistance of a subject is applied. In addition, an image stabilizationfunction that prevents an image from shaking caused by the hand shakingof a photographer has been applied.

Meanwhile, a method through lens shifting has been developed as a methodof performing the image stabilization function, however, in the case ofthe lens shifting model, there is a problem that the length in thex-axis/y-axis direction of the camera device increases as much as thestroke length of the lens.

DETAILED DESCRIPTION OF THE INVENTION Technical Subject

The present embodiment is to provide a camera device that performs animage stabilization function through an image sensor shifting.

Furthermore, it is intended to provide a camera device that performs amore precise image stabilization function by synchronizing the imagesensor shifting and the lens shifting.

In addition, it is intended to provide an optical instrument comprisingthe camera device.

Technical Solution

A camera device according to the present embodiment comprises: a movercomprising a first magnet; a lens; a stator comprising a first coil; afirst substrate; a second substrate movably disposed on the firstsubstrate; an image sensor disposed on the second substrate; a secondcoil disposed on the first substrate; and a second magnet disposed onthe second substrate and facing the second coil, wherein the secondsubstrate comprises: a coupling part coupled to the image sensor, and anextension part extending outwardly from the coupling part so that atleast a portion thereof overlaps with the first substrate in the opticalaxis direction, and the camera device may further comprise a balldisposed between the first substrate and the extension part of thesecond substrate.

The second substrate is a rigid substrate and a flexible third substrateelectrically connecting the first substrate and the second substrate maybe comprised.

The first substrate comprises a groove formed on an upper surface of thefirst substrate, and the ball may be disposed in the groove of the firstsubstrate.

The first substrate comprises a hole, the image sensor is disposed inthe hole of the first substrate, the second coil overlaps the ball in anoptical axis direction, and the second magnet may be disposed on anupper surface of the second substrate and overlapped with the secondcoil in the optical axis direction.

The ball may be disposed between the groove of the first substrate andthe extension part of the second substrate.

The extension part of the second substrate comprises a first extensionpart disposed in a first axis direction with respect to the imagesensor, and a second extension part disposed in a second axis directionperpendicular to the first axis with respect to the image sensor,wherein the third substrate may be disposed between the first axis andthe second axis.

The third substrate may be disposed at a corner side of the imagesensor.

The mover further comprises a housing, a bobbin disposed in the housing;a third coil disposed on the bobbin, and an elastic member connectingthe housing and the bobbin, wherein the first magnet is disposed in thehousing and faces the third coil, and wherein the camera device mayfurther comprise a support member connecting the mover and the stator.

An optical instrument according to the present embodiment comprises: amain body; the camera device of claim 1 disposed on the main body; and adisplay disposed on the main body and outputting an image photographedby the camera device.

The camera device according to the present embodiment may comprise: ahousing; a bobbin disposed inside the housing; a lens coupled to thebobbin; a base disposed under the housing; a first coil disposed on thebobbin; a first magnet disposed in the housing and facing the firstcoil; a second coil disposed on the base and facing the first magnet; afirst substrate disposed under the base; a second substrate at leastpartially being overlapped with the first substrate in an optical axisdirection; a ball disposed between the first substrate and the secondsubstrate; an image sensor disposed on the second substrate; a thirdcoil disposed on the first substrate; a second magnet disposed on theimage sensor and facing the third coil; and a flexible third substrateelectrically connecting the first substrate and the second substrate.

A camera device according to the present embodiment may comprise: amover coupled to a lens; a stator disposed to be spaced apart from themover; a first substrate disposed on one side of the stator; a secondsubstrate movably disposed on the first substrate; an image sensordisposed on the second substrate; a second coil disposed on the firstsubstrate; and a second magnet disposed on the second substrate andfacing the second coil.

The stator comprises a housing and a first magnet disposed in thehousing. The mover may comprise a bobbin disposed in the housing and afirst coil disposed on the bobbin and facing the first magnet.

The mover may comprise a housing, a bobbin disposed in the housing, afirst coil disposed on the bobbin, and a first magnet disposed in thehousing and facing the first coil. The stator may comprise a basedisposed under the housing and a third coil disposed on the base andfacing the first magnet.

The camera device according to the present embodiment comprises: a movercomprising a first magnet; a lens coupled to the mover; a statorcomprising a first coil facing the first magnet and disposed on one sideof the mover; a first substrate disposed on one side of the stator; asecond substrate movably disposed on the first substrate; an imagesensor disposed on the second substrate and comprising a first side; asecond coil disposed on the first substrate; and a second magnetdisposed on the image sensor and facing the second coil, wherein thefirst substrate comprises a first portion corresponding to the firstside of the image sensor, and wherein the second substrate may comprisea plurality of flexible connecting portions coupled to the first portionof the first substrate.

The second substrate may comprise a 2-1 substrate connecting the firstsubstrate and the image sensor in a first axis direction, and a 2-2substrate connecting the first substrate and the image sensor in asecond axis direction perpendicular to the first axis.

The second substrate comprises an inner side portion coupled to theimage sensor and an outer side portion coupled to the first substrate,and the plurality of flexible connecting portions may connect the innerside portion and the outer side portion.

The first substrate comprises a hole, the image sensor is disposed inthe hole of the first substrate, the second coil is disposed on an innerside surface of the hole of the first substrate, and the second magnetmay be disposed on the outer side surface of the image sensor.

The second substrate may be coupled to one surface of the image sensorand to one surface of the first substrate, and a third substratecomprising a connecting portion connected to the outside may be coupledto the other surface of the first substrate.

The camera device may further comprise a reinforcing plate coupled tothe third substrate.

The mover comprises a housing, a bobbin disposed in the housing, a thirdcoil disposed on the bobbin, and an elastic member connecting thehousing and the bobbin, wherein the first magnet is disposed in thehousing and faces the third coil, and the camera device may furthercomprises a support member connecting the mover and the stator.

The image sensor is connected to the second substrate by a flip chip,the second magnet is fixed to the second substrate by an adhesive, andthe second coil is formed as a pattern coil on the first substrate.

An optical instrument according to the present embodiment comprises amain body, a camera device disposed on the main body, and a displaydisposed on the main body and outputting an image photographed by thecamera device.

A camera device according to the present embodiment may comprise: ahousing; a bobbin disposed in the housing; a lens coupled to the bobbin;a base disposed under the housing; a first coil disposed on the bobbin;a first magnet disposed in the housing and facing the first coil; asecond coil disposed on the base and facing the first magnet; a firstsubstrate disposed under the base; an image sensor disposed under thebase at a position corresponding to the lens; a third coil disposed onthe first substrate; a second magnet disposed on the image sensor andfacing the third coil; and a flexible second substrate connecting thefirst substrate and the image sensor.

A camera device according to the present embodiment comprises: a movercoupled to a lens; a stator disposed to be spaced apart from the mover;a first substrate disposed on one side of the stator; a second substratemovably disposed on the first substrate; an image sensor disposed on thesecond substrate and comprising a first side; a second coil disposed onthe first substrate; and a second magnet disposed on the secondsubstrate and facing the second coil, wherein the first substratecomprises a first portion corresponding to the first side of the imagesensor, and wherein the second substrate may comprise a plurality offlexible connecting portions coupled to the first portion of the firstsubstrate.

The stator may comprise a housing and a first magnet disposed in thehousing, and the mover may comprise a bobbin disposed in the housing,and a first coil disposed on the bobbin and facing the first magnet.

The mover comprises: a housing; a bobbin disposed in the housing; afirst coil disposed on the bobbin; and a first magnet disposed in thehousing and facing the first coil, wherein the stator may comprise abase disposed under the housing and a third coil disposed on the baseand facing the first magnet.

Advantageous Effects

Through this embodiment, it is possible to implement an imagestabilization function through image sensor shifting.

Further, it is possible to provide a more precise image stabilizationfunction through synchronization of image sensor shifting and lensshifting.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic cross-sectional view showing a configurationrelated to an image sensor shifting of a camera device according to afirst embodiment, and is a conceptual diagram.

FIG. 2 is a plan view showing a configuration related to image sensorshifting of a camera device according to a first embodiment, and is aconceptual diagram.

FIG. 3 is a schematic cross-sectional view showing a configurationrelated to image sensor shifting of a camera device according to amodified embodiment of a first embodiment, and is a conceptual diagram.

FIG. 4 is a schematic cross-sectional view showing an image sensorshift-related configuration of a camera device according to anothermodified embodiment of a first embodiment, and is a conceptual diagram.

FIG. 5 is a plan view showing a configuration related to an image sensorshifting of a camera device according to another modified embodiment ofa first embodiment, and is a conceptual diagram.

FIG. 6 is a schematic cross-sectional view showing a configurationrelated to an image sensor shifting of a camera device according to asecond embodiment, and is a conceptual diagram.

FIG. 7 is a plan view showing a configuration related to image sensorshifting of a camera device according to a second embodiment, and is aconceptual diagram, and is a conceptual diagram.

FIG. 8 is a plan view showing a configuration related to an image sensorshifting of a camera device according to a modified embodiment of asecond embodiment, and is a conceptual diagram.

FIG. 9 is a plan view showing a configuration related to an image sensorshifting of a camera device according to another modified embodiment ofa second embodiment, and is a conceptual diagram.

FIG. 10 is a perspective view of a lens driving device according to thepresent embodiment.

FIG. 11 is a cross-sectional view as viewed from X-Y of FIG. 10.

FIG. 12 is an exploded perspective view of a lens driving deviceaccording to the present embodiment.

FIG. 13 is an exploded perspective view of the lens driving deviceaccording to the present embodiment as viewed from a different directionfrom FIG. 12.

FIG. 14 is an exploded perspective view showing a first mover andrelated configurations according to the present embodiment.

FIG. 15 is an exploded perspective view showing a second mover accordingto the present embodiment.

FIG. 16 is an exploded perspective view showing a stator according tothe present embodiment.

FIG. 17 is an exploded perspective view showing an elastic member, asupport member, and related configurations according to the presentembodiment.

FIG. 18 is a plan view illustrating a lens driving device according tothe present embodiment with a cover omitted.

FIG. 19 is a cross-sectional view of a camera device according to thefirst embodiment.

FIG. 20 is a cross-sectional view of a camera device according to asecond embodiment.

FIG. 21 is a perspective view showing an optical instrument according tothe present embodiment.

BEST MODE

Hereinafter, for convenience of explanation, some embodiments of thepresent invention will be described through exemplary drawings. However,the technical idea of the present invention is not limited to some ofthe described embodiments.

In describing the components of the embodiment of the present invention,terms such as first, second, A, B, (a), and (b) may be used. These termsare merely intended to distinguish the components from other components,and the terms do not limit the nature, order or sequence of thecomponents.

When a component is described as being “connected” or “coupled” toanother component, the component may be directly “connected”, “coupled”,or “jointed” to another component, but it should be understood thatanother component may be ‘connected’ or ‘coupled’ between the componentand the other component.

The ‘optical axis direction’ used below is defined as the direction ofthe optical axis of a lens coupled to the lens driving device.Accordingly, the ‘optical axis direction’ may coincide with thedirection of the optical axis of the image sensor of the camera module.

The “auto focus function” used below is defined as the function thatautomatically focuses on a subject by moving the lens in the directionof the optical axis according to the distance of the subject so thatclear images of the subject can be obtained on the image sensor.Meanwhile, ‘auto focus’ can be used interchangeably with ‘Auto Focus(AF)’.

The “image stabilization function” used below is defined as a functionof moving or tilting a lens module in a direction perpendicular to theoptical axis direction so as to cancel a vibration (movement) generatedin an image sensor by an external force. Meanwhile, “imagestabilization” may be used interchangeably with “optical imagestabilization (OIS)”.

Hereinafter, the configuration of the optical instrument according tothe present embodiment will be described with reference to the drawings.

FIG. 21 is a perspective view showing an optical instrument according tothe present embodiment.

Optical instruments may be any one of hand phones, mobile phones, smartphones, portable communication devices, portable smart devices, digitalcameras, laptop computers, digital broadcasting terminals, personaldigital assistants (PDAs), portable multimedia players (PMPs), andnavigation. However, the type of optical instrument is not limitedthereto, and any device for photographing an image or a picture may becomprised in the optical instrument.

The optical instrument may comprise a main body 1. The main body 1 mayform the outer appearance of an optical instrument. The main body 1 mayaccommodate a camera device 3. A display 2 may be disposed on onesurface of the main body 1. For example, the display 2 and the cameradevice 3 may be disposed on one side of the main body 1, and the cameradevice 3 may be additionally disposed on the other side of the main body1 (a side located on the opposite side of the main body 1.

The optical instrument may comprise a display 2. The display 2 may bedisposed on one surface of the main body 1. The display 2 may output animage photographed by the camera device 3.

The optical instrument may comprise a camera device 3. The camera device3 may be disposed on the main body 1. At least part of the camera device3 may be accommodated in the body 1. The camera device 3 may be providedin plural. The camera device 3 may comprise a dual camera device. Thecamera device 3 may be disposed on one side of the main body 1 and theother side of the main body 1, respectively. The camera device 3 mayphotograph an image of a subject.

Hereinafter, the configuration of the camera device according to thefirst embodiment will be described with reference to the drawings.

FIG. 1 is a schematic cross-sectional view showing an image sensorshift-related configuration of a camera device according to a firstembodiment, and is a conceptual diagram; FIG. 2 is a plan view showingan image sensor shift-related configuration of a camera device accordingto the first embodiment, and is a conceptual diagram; and FIG. 19 is across-sectional view of a camera device according to the firstembodiment.

The camera device 3 may comprise an image sensor 10. The image sensor 10may be disposed on one side of a stator 400. The image sensor 10 may bedisposed under the stator 400. The image sensor 10 may be disposed at aposition corresponding to the lens. The image sensor 10 may be disposedin a first substrate 20. The image sensor 10 may be electricallyconnected to the first substrate 20. The image sensor 10 may be disposedon a second substrate 30. The image sensor 10 may be flip chip coupledto the second substrate 30. The image sensor 10 may be coupled to thesecond substrate 30 by soldering. The image sensor 10 may be disposed sothat the lens and the optical axis coincide. That is, the optical axisof the image sensor 10 and the optical axis of the lens may be aligned.The image sensor 10 may convert light irradiated to the effective imagearea of the image sensor 10 into an electrical signal. The image sensor10 may be any one of a charge coupled device (CCD), a metal oxidesemiconductor (MOS), a CPD, and a CID.

The camera device 3 may comprise a first substrate 20. The firstsubstrate 20 may be a printed circuit board. The first substrate 20 maybe a cavity PCB. The first substrate 20 may be a rigid substrate. Thefirst substrate 20 may be a PCB comprising a hollow or a hole. A lensdriving device may be disposed on the first substrate 20. In this case,a sensor base 15 may be disposed between the first substrate 20 and thelens driving device. The sensor base 15 comprises a groove, and aterminal portion 412 of a substrate 410 may be disposed in the groove ofa sensor base 15. The first substrate 20 may be disposed on one side ofthe stator 400. The first substrate 20 may be disposed under the stator400. The first substrate 20 may be electrically connected to the lensdriving device. The first substrate 20 may be electrically connected tothe image sensor 10. A fourth substrate 80 comprising a connection part81 connected to the outside may be coupled to the other surface (lowersurface) of the first substrate 20.

The first substrate 20 may comprise a hole 21. The hole 21 of the firstsubstrate 20 may be formed in the center of the first substrate 20. Theimage sensor 10 may be disposed in the hole 21 of the first substrate20. The hole 21 of the first substrate 20 may be formed in a shapecorresponding to the image sensor 10. However, the size of the hole 21of the first substrate 20 may be formed to be larger than the size ofthe image sensor 10 in order to secure the stroke space of the imagesensor 10 within the hole 21 of the first substrate 20.

The first substrate 20 may comprise a groove 22. The groove 22 may beformed on the upper surface of the first substrate 20. The groove 22 mayaccommodate at least a portion of the ball 70. The groove 22 may beformed to have a width corresponding to the diameter of a ball 70 or awidth greater than the diameter of the ball 70. The groove 22 maycomprise four grooves spaced apart from each other. The ball 70 may bedisposed in each of the four grooves. The four grooves may be formed atpositions corresponding to the four extension parts 32. The groove 22may be formed so that the ball 70 disposed in the groove 22 does notseparate from the groove 22.

The camera device 3 may comprise a second substrate 30. The secondsubstrate 30 may comprise a rigid substrate. The second substrate 30 maybe movably disposed on the first substrate 20. The second substrate 30may be coupled to one surface (upper surface) of the image sensor 10.The image sensor 10 may be flip-chip coupled to the second substrate 30.The image sensor 10 may be fixed to the second substrate 30. The secondsubstrate 30 and the image sensor 10 can move integrally. The couplingbetween the second substrate 30 and the image sensor 10 may be performedby solder balls or Ag epoxy. The second substrate 30 may comprise ahollow or a hole. An optical path between the image sensor 10 and thelens may be formed through a hole or a hollow of the second substrate30.

The second substrate 30 may comprise a coupling part 31. The couplingpart 31 may be coupled to the image sensor 10. The coupling part 31 mayhave a rectangular frame shape. The coupling part 31 may overlap theimage sensor 10 in the optical axis direction. The coupling part 31 maybe disposed on the image sensor 10.

The second substrate 30 may comprise an extension part 32. The extensionpart 32 may extend outwardly from the coupling part 31 so that at leasta portion of the extension part 32 may be overlapped with the firstsubstrate 20 in the optical axis direction. The extension part 32 may besupported by the ball 70. The extension part 32 may be formed to berigid.

The extension part 32 may comprise a plurality of extension parts. Theextension part 32 may comprise four extension parts 32. The extensionpart 32 may comprise a first extension part 32-1 disposed in a firstaxis direction with respect to the image sensor 10 and a secondextension part 32-2 disposed in a second axis direction perpendicular tothe first axis with respect to the image sensor 10. In this case, one ofthe first axis and the second axis may be an x-axis and the other may bea y-axis. Each of the first extension part 32-1 and the second extensionpart 32-2 may comprise two extension parts disposed at the opposite sidefrom each other.

The camera device 3 may comprise a second coil 40. The second coil 40may be disposed on the first substrate 20. The second coil 40 may bedisposed on the inner side surface of the hole 21 of the first substrate20. The second coil 40 may be formed as a pattern coil on the firstsubstrate 20. The second coil 40 may be integrally formed with the firstsubstrate 20 as a fine pattern coil. The second coil 40 may beoverlapped with the ball 70 in the optical axis direction. Through thisstructure, the size of the first substrate 20 in the x-axis/y-axisdirection can be minimized. When current is applied to the second coil40, the second coil 40 may electromagnetically interact with a secondmagnet 50.

The second coil 40 may comprise a plurality of coils. The second coil 40may comprise a 2-1 coil 41 disposed in the first axis direction withrespect to the image sensor 10 and a 2-2 coil 42 disposed on a secondaxis direction perpendicular to the first axis with respect to the imagesensor 10. In the first embodiment, when a current is applied to the 2-1coil 41, the image sensor 10 moves in the direction of the first axis,and when current is applied to the 2-2 coil 42, the image sensor 10 canbe moved in the direction of the second axis.

The camera device 3 may comprise a second magnet 50. The second magnet50 may be disposed on the second substrate 30. The second magnet 50 maybe disposed on the image sensor 10. The second magnet 50 may be movedintegrally with the image sensor 10. The second magnet 50 may bedisposed to be spaced apart from the image sensor 10. The second magnet50 may be facing the second coil 40. The second magnet 50 may bedisposed on the outer side surface of the image sensor 10. The secondmagnet 50 may be fixed to the second substrate 30 by an adhesive.

The second magnet 50 may comprise a 2-1 magnet 51 facing the 2-1 coil 41and a 2-2 magnet 52 facing the 2-2 coil 42. Each of the 2-1 magnet 51and the 2-2 magnet 52 may comprise two magnets.

In the first embodiment, image sensor shifting can be performed throughthe second magnet 50 disposed on the second substrate 30 or the imagesensor 10 and the second coil 40 disposed on the first substrate 20.That is, when current is applied to the second coil 40, the secondmagnet 50 moves due to the electromagnetic interaction between thesecond coil 40 and the second magnet 50, and at this time, as the imagesensor 10 being moved integrally with the second magnet 50 is movedtogether, an image stabilization (OIS) function can be performed. TheOIS driving of the image sensor shifting method of the first embodimenthas the advantage of reducing the size of the lens and the lens drivingdevice because there is no movement of the lens compared to the OISdriving of a lens shifting method. In particular, the size may bereduced in the x-axis/y-axis direction. In addition, in a lens shiftingmethod, disconnection of a wire for supporting the movement of the lensmay occur, but in an image sensor shifting method, this problem can besolved.

In the first embodiment, OIS may be performed only by shifting the imagesensor 10, but a more precise OIS function may be performed bysynchronizing the movement of the image sensor 10 and the movement ofthe lens. That is, the image sensor 10 and the lens may move in the samedirection by the same distance. When a synchronized shifting between theimage sensor 10 and the lens according to the first embodiment isperformed, even when the camera device is shaken by the user's handshaking of the camera device, a state in which there is no movementbetween the image sensor 10 and the lens at all is maintained, and thus,perfect image stabilization can be performed. That is, the synchronizedshifting structure between the image sensor 10 and the lens according tothe first embodiment can provide enhanced image stabilization (OIS)function compared to a structure in which only the image sensor 10 isshifted or only the lens is shifted.

In the first embodiment, the second coil 40 is disposed on the firstsubstrate 20 and the second magnet 50 is disposed on the secondsubstrate 30, but in the modified embodiment, the second magnet 50 isdisposed on the first substrate 20 and the second coil may be disposedon the second substrate 30.

The camera device 3 may comprise a third substrate 60. The thirdsubstrate 60 may comprise a flexible substrate. The third substrate 60may be a flexible printed circuit board (FPCB). The third substrate 60may electrically connect the first substrate 20 and the image sensor 10.The third substrate 60 may connect the second substrate 30 and the firstsubstrate 20. The third substrate 60 may be coupled to the upper surfaceof the first substrate 20. The third substrate 60 may be coupled to ananisotropic conductive film (ACF) or flip chip to the cavity PCB of thefirst substrate 20. The coupling between the third substrate 60 and thefirst substrate 20 may be performed by solder balls or Ag epoxy. Thethird substrate 60 may be extended from the side surface of the secondsubstrate 30. The second substrate 30 and the third substrate 60 may bea rigid flexible printed circuit board (RFPCB) formed integrally. Atthis time, the second substrate 30 may comprise a rigid substrate andthe third substrate 60 may comprise a flexible substrate. The thirdsubstrate 60 may electrically connect the image sensor 10 and the firstsubstrate 20 while being bent or unfolded. The third substrate 60 may bedisposed at a corner of the second substrate 30.

The third substrate 60 may comprise a plurality of third substrates. Thethird substrate 60 may comprise four third substrates. The four thirdsubstrates may be disposed to be symmetrical to each other. Among thefour third substrates, two third substrates may be disposed in a thirdaxis direction, and the remaining two third substrates may be disposedin a fourth axis direction. The third substrate 60 may be disposedbetween the first extension part 32-1 and the second extension part 32-2of the second substrate 30. The third substrate 60 may be disposed atthe corner side of the image sensor 10. The third substrate 60 may bedisposed between the first axis and the second axis. The third substrate60 may be disposed in a space between the first axis and the secondaxis. At this time, the first axis may be an axis in a direction inwhich the first extension part 32-1 is disposed and the second axis maybe an axis in a direction in which the second extension part 32-2 isdisposed.

The third substrate 60 may comprise a connection part 61 connected tothe second substrate 30 and a coupling part 62 formed at the end of theconnection part 61 and coupled to the upper surface of the firstsubstrate 20. In the first embodiment, the connection part 61 may bedisposed in a diagonal direction with respect to the image sensor 10.

The camera device 3 may comprise a ball 70. The ball 70 may be disposedbetween the first substrate 20 and the second substrate 30. The ball 70may be disposed in the groove 22 of the first substrate 20. The ball 70may be disposed between the extension part 32 of the first substrate 20and the second substrate 30. The ball 70 may movably support the secondsubstrate 30. The ball 70 may comprise a ‘guide ball’. The ball 70 maycomprise a plurality of balls. The ball 70 comprises a total of 12balls, and three balls support one extension part 32, so that a total of12 balls may support four extension parts 32. The ball 70 may berotatably accommodated in the groove 22 of the first substrate 20. Theball 70 may have a spherical shape.

The camera device 3 may comprise a fourth substrate 80. The fourthsubstrate 80 may be a printed circuit board. The fourth substrate 80 maycomprise an FPCB. The fourth substrate 80 may be coupled to the othersurface (lower surface) of the first substrate 20. The fourth substrate80 may comprise a connection part 81 connected to the outside. Theconnection part 81 may comprise a connector. The connection part 81 maybe connected to a component of an optical instrument in the outside ofthe camera device 3.

The camera device 3 may comprise a reinforcing plate 90. The reinforcingplate 90 may be coupled to the fourth substrate 80. The reinforcingplate 90 may be formed of a stainless steel (SUS). The reinforcing plate90 may comprise a first reinforcing plate 91 disposed on a lower surfaceof the fourth substrate 80 at a position corresponding to the firstsubstrate 20. The reinforcing plate 90 may comprise a second reinforcingplate 92 disposed at a position corresponding to the connection part 81on the upper surface of the fourth substrate 80.

The camera device 3 may comprise a lens module. The lens module maycomprise at least one lens. The lens module may comprise a barrel and aplurality of lenses coupled to the inside of the barrel. The lens modulemay be coupled to a bobbin 210 of the lens driving device. The lensmodule may be coupled to the bobbin 210 by screw-coupling and/or anadhesive. The lens module can move integrally with the bobbin 210. Thelens may be coupled to movers 200 and 300. The lens may be coupled to afirst mover 200.

The camera device 3 may comprise a filter. The filter may be an infraredfilter. The infrared filter may block light in the infrared region fromentering into the image sensor 10. The infrared filter may be disposedbetween the lens and the image sensor 10. For example, the infraredfilter may be disposed on the sensor base 15 disposed between the lensdriving device and the first substrate 20. As another example, theinfrared filter may be disposed on a base 430.

The camera device 3 may comprise a controller. The controller may bedisposed on the first substrate 20. The controller may individuallycontrol the direction, intensity, and amplitude of current supplied to afirst coil 422, the second coil 40, and a third coil 220 of the lensdriving device. The controller may perform an auto focus function and/oran image stabilization function by controlling the lens driving device.Furthermore, the controller may perform auto focus feedback controland/or image stabilization feedback control for the lens driving device.

FIG. 3 is a schematic cross-sectional view showing a configurationrelated to image sensor shifting of a camera device according to amodified embodiment of the first embodiment, and is a conceptualdiagram.

The modified embodiment may comprise a fifth substrate 30 a and a sixthsubstrate 60 a which are modified forms of the second substrate 30 andthe third substrate 60 of the first embodiment. The sixth substrate 60 amay be extended from the inner side surface of the fifth substrate 30 a.At this time, the image sensor 10 may be flip-chip coupled to the sixthsubstrate 60 a. The sixth substrate 60 a may be coupled to the uppersurface of the first substrate 20. That is, one end portion of the sixthsubstrate 60 a may be coupled to the image sensor 10 and the other endportion of the sixth substrate 60 a may be coupled to the firstsubstrate 20.

FIG. 4 is a schematic cross-sectional view showing an image sensorshift-related configuration of a camera device according to anothermodified embodiment of a first embodiment, and is a conceptual diagram.

Another modified embodiment may comprise a fourth coil 40 a and a fifthmagnet 50 a which are the modified form of the second coil 40 and thesecond magnet 50 of the first embodiment. The fifth magnet 50 a may bedisposed on the upper surface of the second substrate 30. The fifthmagnet 50 a may be overlapped the fourth coil 40 a in the optical axisdirection. The fourth coil 40 a may be disposed under the ball 70. Thefourth coil 40 a may be overlapped with the ball 70 in the optical axisdirection. The ball 70 may be disposed between the fourth coil 40 a andthe fifth magnet 50 a in the optical axis direction. According toanother modified embodiment, the size of the first substrate 20 in thex-axis/y-axis direction may be reduced compared to the first embodiment.

FIG. 5 is a plan view showing a configuration related to an image sensorshifting of a camera device according to another modified embodiment ofa first embodiment, and is a conceptual diagram.

Yet another modified embodiment may comprise the seventh substrate 30 b,a fifth coil 40 b, a sixth magnet 50 b, an eighth substrate 60 b, and aball 70 b which are modified forms of the second substrate 30, thesecond coil 40, the second magnet 50, the third substrate 60, and theball 70 of the first embodiment.

The seventh substrate 30 b may comprise a coupling part 31 b and anextension part 32 b. However, compared with the first embodiment, thelocation of the extension part 32 b may be changed. In the firstembodiment, the extension part 32 is disposed at the center of one sidewall of the coupling part 31, but in another modified embodiment, theextension part 32 b may be disposed to be biased toward the corner sidefrom one side of the coupling part 31 b. Through this, the eighthsubstrate 60 b may be disposed from one side of the coupling part 31 bto the other corner side. That is, the eighth substrate 60 b may bedisposed on a side (edge) of the coupling part 31 b rather than acorner. The ball 70 b may be disposed to be biased toward a corner sideof the first substrate 20 to support the extension part 32 b. The fifthcoil 40 b may be disposed to be biased toward a corner side of the firstsubstrate 20. The sixth magnet 50 b may be disposed to face the fifthcoil 40 b at a corner side of the coupling part 31 b. The eighthsubstrate 60 b may comprise a connection part 61 b extending in thex-axis or y-axis direction from the coupling part 31 b, and a couplingpart 62 b coupled to the first substrate 20. The eighth substrate 60 bmay be disposed in parallel with the extension part 32 b. The eighthsubstrate 60 b may be disposed to be spaced apart from the extensionpart 32 b. The eighth substrate 60 b may be disposed in a directioncorresponding to the extension part 32 b. The eighth substrate 60 b maybe disposed in the same direction as the extension part 32 b.

Hereinafter, a configuration of a camera device according to a secondembodiment will be described with reference to the drawings.

FIG. 6 is a schematic cross-sectional view showing a configurationrelated to an image sensor shifting of a camera device according to asecond embodiment, and is a conceptual diagram; FIG. 7 is a plan viewshowing a configuration related to image sensor shifting of a cameradevice according to a second embodiment, and is a conceptual diagram;and FIG. 20 is a cross-sectional view of a camera device according to asecond embodiment.

The camera device 3 may comprise an image sensor 1010. The image sensor1010 may be disposed on one side of the stator 400. The image sensor1010 may be disposed under the stator 400. The image sensor 1010 may bedisposed at a position corresponding to the lens. The image sensor 1010may be electrically connected to a first substrate 1020. The imagesensor 1010 may be flip chip coupled to a second substrate 1030. Theimage sensor 1010 may be disposed so that the lens and the optical axiscoincide. That is, the optical axis of the image sensor 1010 and theoptical axis of the lens may be aligned. The image sensor 1010 mayconvert light irradiated to the effective image area of the image sensor1010 into an electrical signal. The image sensor 1010 may be any one ofa charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD,and a CID. The image sensor 1010 may comprise a first side. The imagesensor 1010 may comprise a plurality of sides. The image sensor 1010 maycomprise four sides. The image sensor 1010 may comprise first to fourthsides. The plurality of sides of the image sensor 1010 may be formed asthe plurality of side surfaces of the image sensor 1010 meet the uppersurface or the lower surface of the image sensor 1010.

The camera device 3 may comprise a first substrate 1020. The firstsubstrate 1020 may be a printed circuit board. The first substrate 1020may be a cavity PCB. The first substrate 1020 may be a rigid substrate.The first substrate 1020 may be a hollow or a PCB comprising a hole. Alens driving device may be disposed on the first substrate 1020. At thistime, a sensor base 1015 may be disposed between the first substrate1020 and the lens driving device. The sensor base 1015 may comprise agroove, and a terminal portion 412 of the substrate 410 may be disposedin the groove of the sensor base 1015. The first substrate 1020 may bedisposed on one side of the stator 400. The first substrate 1020 may bedisposed under the stator 400. The first substrate 1020 may beelectrically connected to the lens driving device. The first substrate1020 may be electrically connected to the image sensor 1010. A thirdsubstrate 1060 comprising a connection part 1061 connected to the outerside may be coupled to the other surface (lower surface) of the firstsubstrate 1020.

The first substrate 1020 may comprise a first portion corresponding tothe first side of the image sensor 1010. The first substrate 1020 maycomprise a second portion corresponding to the second side of the imagesensor 1010. The first substrate 1020 may comprise a third portioncorresponding to the third side of the image sensor 1010. The firstsubstrate 1020 may comprise a fourth portion corresponding to the fourthside of the image sensor 1010. Each of the first to fourth portions ofthe first substrate 1020 may be connected to a connection part 1033 ofthe second substrate 1030. That is, the second substrate 1030 comprisesa unit of the connection part 1033 divided into four areas, and the unitof the connection part 1033 may be connected to the first to fourthportions, respectively.

The first substrate 1020 may comprise a hole 1021. The hole 1021 of thefirst substrate 1020 may be formed in the center of the first substrate1020. An image sensor 1010 may be disposed in the hole 1021 of the firstsubstrate 1020. The hole 1021 of the first substrate 1020 may be formedin a shape corresponding to the image sensor 1010. However, the size ofthe hole 1021 of the first substrate 1020 may be formed to be largerthan the size of the image sensor 1010 so that the stroke space of theimage sensor 1010 can be secured inside the hole 1021 of the firstsubstrate 1020.

The camera device 3 may comprise a second substrate 1030. The secondsubstrate 1030 may be a flexible substrate. The second substrate 1030may be a flexible printed circuit board (FPCB). The second substrate1030 may connect the first substrate 1020 and the image sensor 1010. Thesecond substrate 1030 may be coupled to one surface (upper surface) ofthe image sensor 1010 and one surface (upper surface) of the firstsubstrate 1020. The image sensor 1010 may be flip-chip coupled to thesecond substrate 1030. The second substrate 1030 may be coupled to ananisotropic conductive film (ACF) or flip chip to the cavity PCB of thefirst substrate 1020. A portion of the lower surface of the secondsubstrate 1030 may be coupled to the upper surface of the image sensor1010, and another portion of the lower surface of the second substrate1030 may be coupled to the upper surface of the first substrate 1020.The coupling between the second substrate 1030 and the image sensor 1010and the coupling between the second substrate 1030 and the firstsubstrate 1020 may be performed by solder balls or Ag epoxy.

The second substrate 1030 may comprise a 2-1 substrate 1010-1 thatconnects the first substrate 1020 and the image sensor 1010 in a firstaxis direction, and a 2-2 substrate 1030-2 that connects the firstsubstrate 1020 and the image sensor 1010 in a second axis directionperpendicular to the first axis. At this time, one of the first axis andthe second axis may be an x axis and the other may be a y axis. Each ofthe 2-1 substrate 1030-1 and the 2-2 substrate 1030-2 may comprise twosubstrates. The 2-1 substrate 1010-1 supports the movement of the imagesensor 1010 in the first axis direction, and the 2-2 substrate 1030-2may support the movement of the image sensor 1010 in the second axisdirection.

The second substrate 1030 may comprise an inner side portion 1031coupled with the image sensor 1010, an outer side portion 1032 coupledwith the first substrate 1020, and a flexible connection part 1033 thatconnects the inner side portion 1031 and the outer side portion 1032.The inner side portion 1031 may have a rectangular frame shape. Theinner side portion 1031 comprises a hole, and an optical path betweenthe image sensor 1010 and the lens may be formed through the hole in theinner side portion 1031. The outer side portion 1032 may comprise fourouter side portions 1032 spaced apart from each other. At this time, twoouter side portions 1032 of the four outer side portions 1032 aredisposed in the first axis direction with respect to the image sensor1010, and the other two outer side portions 1032 may be disposed in thesecond axis direction with respect to the image sensor 1010. Theconnection part 1033 may comprise four connection parts 1033 that arespaced apart from each other. The four connection parts 1033 may beconnected to the four outer side portions 1032, respectively. Each ofthe four connection parts 1033 may comprise a plurality of conductivelines. The plurality of conductive lines may be formed of a plurality ofstrands spaced apart from each other. The plurality of conductive linesmay comprise 10 conductive lines. The connection part 1033 haselasticity and may elastically support the movement of the image sensor1010. That is, the second substrate 1030 may movably support the imagesensor 1010.

The camera device 3 may comprise a second coil 1040. The second coil1040 may be disposed on the first substrate 1020. The second coil 1040may be disposed on the inner side surface of the hole 1021 of the firstsubstrate 1020. The second coil 1040 may be formed as a pattern coil onthe first substrate 1020. The second coil 1040 may be integrally formedwith the first substrate 1020 as a fine pattern coil.

The second coil 1040 may comprise a plurality of coils. The second coil1040 may comprise a 2-1 coil 1041 disposed in a first axis directionwith respect to the image sensor 1010 and a 2-2 coil 1042 disposed in asecond axis direction perpendicular to the first axis with respect tothe image sensor 1010. In a second embodiment, when current is appliedto the 2-1 coil 1041, the image sensor 1010 moves in the direction ofthe first axis, and when current is applied to the 2-2 coil 1042, theimage sensor 1010 may move in the second axis direction.

The camera device 3 may comprise a second magnet 1050. The second magnet1050 may be disposed on the image sensor 1010. The second magnet 1050can move integrally with the image sensor 1010. The second magnet 1050may be coupled to the inner side portion 1031 of the second substrate1030 being coupled to the image sensor 1010. At this time, the secondmagnet 1050 may be disposed to be spaced apart from the image sensor1010. However, even in this case, the second magnet 1050 and the imagesensor 1010 can move integrally. The second magnet 1050 may face thesecond coil 1040. The second magnet 1050 may be disposed on the outerside surface of the image sensor 1010. The second magnet 1050 may befixed to the second substrate 1030 by an adhesive.

The second magnet 1050 may comprise a 2-1 magnet 1051 facing the 2-1coil 1041 and a 2-2 magnet 1052 facing the 2-2 coil 1042. Each of the2-1 magnet 1051 and the 2-2 magnet 1052 may comprise two magnets.

In the second embodiment, image sensor shifting may be performed throughthe second magnet 1050 disposed on the image sensor 1010 and the secondcoil 1040 disposed on the first substrate 1020. That is, when current isapplied to the second coil 1040, the second magnet 1050 moves due to theelectromagnetic interaction between the second coil 1040 and the secondmagnet 1050, and at this time, as the image sensor 1010 that movesintegrally moves together, image stabilization (OIS) function may beperformed. The OIS driving of the image sensor shifting method of thesecond embodiment has the advantage of reducing the size of the lens andthe lens driving device because there is no lens movement compared tothe OIS driving of the lens shifting method. In particular, the size maybe reduced in the x-axis/y-axis direction. In addition, in the lensshifting method, disconnection of a wire that supports the movement ofthe lens may occur, but in the image sensor shifting method, thisproblem can be solved.

In the second embodiment, OIS may be performed only by shifting theimage sensor 1010, but a more precise OIS function may be performed bysynchronizing the movement of the image sensor 1010 and the movement ofthe lens. That is, the image sensor 1010 and the lens may move in thesame direction by the same distance. When a synchronization shiftingbetween the image sensor 1010 and the lens according to the secondembodiment is performed, even when the camera device is shaken by theuser's hand shaking of the camera device, the image sensor 1010 and thelens are kept in a state of no movement between them, and therefore, aperfect image stabilization can be performed. That is, thesynchronization shift structure between the image sensor 1010 and thelens according to the second embodiment may provide enhanced imagestabilization (OIS) function compared to a structure in which only theimage sensor 1010 is shifted or only the lens is shifted.

In the second embodiment, the second coil 1040 is disposed on the firstsubstrate 1020 and the second magnet 1050 is disposed on the secondsubstrate 1030, but in the modified embodiment, the second magnet 1050is disposed on the first the substrate 1020 and the second coil 1040 maybe disposed on the second substrate 1030.

The camera device 3 may comprise a third substrate 1060. The thirdsubstrate 1060 may be a printed circuit board. The third substrate 1060may comprise an FPCB. The third substrate 1060 may be coupled to theother surface (lower surface) of the first substrate 1020. The thirdsubstrate 1060 may comprise a connection part 1061 connected to theouter side. The connection part 1061 may comprise a connector. Theconnection part 1061 may be connected to a configuration of an opticalinstrument in the outside of the camera device 3.

The camera device 3 may comprise a reinforcing plate 1070. Thereinforcing plate 1070 may be coupled to the third substrate 1060. Thereinforcing plate 1070 may be formed of a stainless steel (SUS). Thereinforcing plate 1070 may comprise a first reinforcing plate 1071disposed at a position corresponding to the first substrate 1020 on thelower surface of the third substrate 1060. The reinforcing plate 1070may comprise a second reinforcing plate 1072 disposed at a positioncorresponding to the connection part 1061 on the upper surface of thethird substrate 1060.

The camera device 3 may comprise a lens module. The lens module maycomprise at least one lens. The lens module may comprise a barrel and aplurality of lenses coupled to the inside of the barrel. The lens modulemay be coupled to the bobbin 210 of the lens driving device. The lensmodule may be coupled to the bobbin 210 by screw-coupling and/or anadhesive. The lens module can move integrally with the bobbin 210. Thelens may be coupled to the movers 200 and 300. The lens may be coupledto the first mover 200.

The camera device 3 may comprise a filter. The filter may comprise aninfrared filter. The infrared filter may block the incident of light inthe infrared region to the image sensor 1010. The infrared filter may bedisposed between the lens and the image sensor 1010. For example, theinfrared filter may be disposed on the sensor base 1015 disposed betweenthe lens driving device and the first substrate 1020. As anotherexample, the infrared filter may be disposed on the base 430.

The camera device 3 may comprise a controller. The controller may bedisposed on the first substrate 1020. The controller may individuallycontrol the direction, intensity, and amplitude of the current suppliedto the first coil 422, the second coil 1040, and the third coil 220 ofthe lens driving device. The controller may perform an auto focusfunction and/or an image stabilization function by controlling the lensdriving device. Further, the controller may perform auto focus feedbackcontrol and/or image stabilization feedback control for the lens drivingdevice.

FIG. 8 is a plan view showing a configuration related to an image sensorshifting of a camera device according to a modified embodiment of asecond embodiment, and is a conceptual diagram.

In a modified embodiment, the positions of the second coil 1040, thesecond magnet 1050, and the connection part 1033 of the second substrate1030 may be changed compared to the second embodiment. In a modifiedembodiment, the second coil 1040 may comprise a 2-3 coil 1041-1 disposedin a first axis direction of the image sensor 1010, and 2-4 coils 1042-1disposed in a second axis direction of the image sensor 1010. At thistime, the first axis and the second axis may be perpendicular to eachother. The 2-3 coil 1041-1 and the 2-4 coil 1042-1 may not be overlappedwith the connection part 1033 of the second substrate 1030 in a verticaldirection. That is, in the modified example, the second coil 1040 andthe connection part 1033 of the second substrate 1030 may be disposed soas not to be interfered with each other. In a modified embodiment, thesecond magnet 1050 may comprise a the 2-3 magnet 1051-1 facing the 2-3coil 1041-1 and a 2-4 magnet 1052-1 facing the 2-4 coil 1042-1.

FIG. 9 is a plan view showing a configuration related to an image sensorshifting of a camera device according to another modified embodiment ofa second embodiment, and is a conceptual diagram.

In another modified embodiment, the positions of the second coil 1040and the second magnet 1050 may be changed compared to the secondembodiment. In another modification, the second coil 1040 and the secondmagnet 1050 may be disposed at a corner side of the image sensor 1010.In the second embodiment and the previous modified embodiment, thesecond coil 1040 and the second magnet 1050 are different from thosedisposed on the side surface of the image sensor 1010. In anothermodified embodiment, the second coil 1040 may comprise a 2-5 coils1041-2 disposed in a first axis direction, which is a diagonal directionof the image sensor 1010, and a 2-6 coil 1042-2 disposed in a secondaxis direction of the image sensor 1010. At this time, the first axisand the second axis may be perpendicular to each other. The 2-5 coil1041-2 and the 2-6 coil 1042-2 may not vertically overlap the connectionpart 1033 of the second substrate 1030. That is, in another modifiedembodiment, the second coil 1040 and the connection part 1033 of thesecond substrate 1030 may be disposed so as not to be interfered witheach other. In another modified embodiment, the second magnet 1050 maycomprise a 2-5 magnet facing the 2-5 coil 1041-2 and a 2-6 magnet facingthe 2-6 coil 1042-2.

Hereinafter, a configuration of a lens driving device according to thepresent embodiment will be described with reference to the drawings.

FIG. 10 is a perspective view of a lens driving device according to thepresent embodiment; FIG. 11 is a cross-sectional view as viewed from X-Yof FIG. 10; FIG. 12 is an exploded perspective view of a lens drivingdevice according to the present embodiment; FIG. 13 is an explodedperspective view of a lens driving device according to the presentembodiment viewed from a different direction than FIG. 12; FIG. 14 is anexploded perspective view showing a first mover and relatedconfiguration according to the present embodiment; FIG. 15 is anexploded perspective view showing a second mover according to thepresent embodiment; FIG. 16 is an exploded perspective view showing astator according to the present embodiment; FIG. 17 is an explodedperspective view showing an elastic member, a support member, andrelated configurations according to the present embodiment; FIG. 18 is aplan view illustrating a lens driving device according to the presentembodiment with a cover omitted.

The lens driving device may be a voice coil motor (VCM). The lensdriving device may be a lens driving motor. The lens driving device maybe a lens driving actuator. The lens driving device may comprise an AFmodule. The lens driving device may comprise an OIS module. In thepresent embodiment, a case in which the lens driving device is an OISmodule capable of both AF driving and OIS driving is described throughthe drawings, but in a modified embodiment, the lens driving device maybe replaced with an AF module capable of only AF driving.

In another modified embodiment, the lens driving device may be of afixed focus (FF) type that is fixed so that the lens does not move inthe optical axis direction.

The lens driving device may comprise a cover 100. The cover 100 maycomprise a ‘cover can’. The cover 100 may be disposed outside thehousing 310. The cover 100 may be coupled to the base 430. The cover 100may accommodate the housing 310 therein. The cover 100 may form theouter appearance of the lens driving device. The cover 100 may have ahexahedral shape with an open lower surface. The cover 100 may be anon-magnetic material. The cover 100 may be formed of a metal material.The cover 100 may be formed of a metal plate. The cover 100 may beconnected to the ground portion of the first substrate 20. Through this,the cover 100 may be grounded. The cover 100 may block electromagneticinterference (EMI). At this time, the cover 100 may be referred to as‘EMI shield can’.

The cover 100 may comprise an upper plate 110 and a side plate 120. Thecover 100 may comprise an upper plate 110 comprising a hole 111 and aside plate 120 being extended downward from an outer circumference oredge of the upper plate 110. The lower end of the side plate 120 of thecover 100 may be disposed on a step portion 434 of the base 430. Theinner surface of the side plate 120 of the cover 100 may be fixed to thebase 430 by an adhesive.

The upper plate 110 of the cover 100 may comprise a hole 111. The hole111 may comprise an ‘opening’. The hole 111 may be formed in the upperplate 110 of the cover 100. When viewed from above, the lens can be seenthrough the hole 111. The hole 111 may be formed in a size and shapecorresponding to the lens. The size of the hole 111 may be larger thanthe diameter of the lens module so that the lens module can be insertedand assembled through the hole 111. The light introduced through thehole 111 may pass through the lens. At this time, the light that haspassed through the lens may be converted into an electrical signal bythe image sensor 10 and obtained as an image.

The lens driving device may comprise movers 200 and 300. The movers 200and 300 may be parts being moved when a current is applied to the lensdriving device. The movers 200 and 300 may comprise a first mover 200and a second mover 300.

The lens driving device may comprise a first mover 200. The first mover200 may be coupled with a lens. The first mover 200 may be coupled tothe second mover 300 through an elastic member 500. The first mover 200may move through an interaction with the second mover 300. At this time,the first mover 200 can move integrally with the lens. Meanwhile, thefirst mover 200 may move during AF driving. At this time, the firstmover 200 may be referred to as an ‘AF mover’. However, the first mover200 may be moved together with the second mover 300 even during OISdriving.

The first mover 200 may comprise a bobbin 210. The bobbin 210 may bedisposed inside the housing 310. The bobbin 210 may be disposed in ahole 311 of the housing 310. The bobbin 210 may be movably coupled tothe housing 310. The bobbin 210 may move in the optical axis directionwith respect to the housing 310. A lens may be coupled to the bobbin210. The bobbin 210 and the lens may be coupled by screw-coupling and/oran adhesive. A third coil 220 may be coupled to the bobbin 210. A firstelastic member 510 may be coupled to an upper surface of the bobbin 210.A second elastic member 520 may be coupled to a lower surface of thebobbin 210. The bobbin 210 may be coupled to the elastic member 500 byheat fusion and/or an adhesive. The adhesive bonding the bobbin 210 andthe lens, and the bobbin 210 and the elastic member 500 may be an epoxycured by at least one of ultraviolet (UV), heat, and laser.

The bobbin 210 may comprise a hole 211. The hole 211 may penetrate thebobbin 210 in the optical axis direction. A lens module may beaccommodated in the hole 211. For example, a thread corresponding to athread formed on the outer circumferential surface of the lens modulemay be disposed on the inner circumferential surface of the bobbin 210forming the hole 211.

The bobbin 210 may comprise a driving part coupling part 212. A thirdcoil 220 may be coupled to the driving part coupling part 212. Thedriving part coupling part 212 may be formed on the outercircumferential surface of the bobbin 210. The driving part couplingpart 212 may comprise a groove formed by recessing a portion of an outerside surface of the bobbin 210. The third coil 220 may be accommodatedin the groove of the driving part coupling part 212. The driving partcoupling part 212 may comprise a protrusion supporting the lower surfaceof the third coil 220.

The first mover 200 may comprise a third coil 220. The third coil 220may be an ‘AF driving coil’ used for AF driving. The third coil 220 maybe disposed on the bobbin 210. The third coil 220 may be disposedbetween the bobbin 210 and the housing 310. The third coil 220 may bedisposed on an outer side surface or an outer circumferential surface ofthe bobbin 210. The third coil 220 may be directly wound on the bobbin210. Or, the third coil 220 may be coupled to the bobbin 210 while beingdirectly wound. The third coil 220 may face the first magnet 320. Thethird coil 220 may be disposed to face the first magnet 320. The thirdcoil 220 may electromagnetically interact with the first magnet 320. Inthis case, when a current is supplied to the third coil 220 and anelectromagnetic field is formed around the third coil 220, the thirdcoil 220 may move with respect to the first magnet 320 by theelectromagnetic interaction between the third coil 220 and the firstmagnet 320. The third coil 220 may be formed as a single coil. Or, thethird coil 220 may comprise a plurality of coils spaced apart from eachother.

The third coil 220 may comprise a pair of lead wires for supplyingpower. At this time, one end (lead wire) of the third coil 220 iscoupled with a 1-5 elastic member 505, and the other end (lead wire) ofthe third coil 220 may be coupled with a 1-6 elastic member 506. Thatis, the third coil 220 may be electrically connected to the firstelastic member 510. In more detail, the third coil 220 may sequentiallyreceive power through the first substrate 20, the substrate 410, asupport member 600, and the first elastic member 510. As a modifiedembodiment, the third coil 220 may be electrically connected to thesecond elastic member 520.

The lens driving device may comprise a second mover 300. The secondmover 300 may be movably coupled to the stator 400 through the supportmember 600. The second mover 300 may support the first mover 200 throughthe elastic member 500. The second mover 300 may move the first mover200 or may move together with the first mover 200. The second mover 300may move through interaction with the stator 400. The second mover 300may move during OIS driving. At this time, the second mover 300 may bereferred to as an ‘OIS mover’. The second mover 300 can move integrallywith the first mover 200 during OIS driving.

The second mover 300 may comprise a housing 310. The housing 310 may bedisposed outside the bobbin 210. The housing 310 may accommodate atleast a portion of the bobbin 210. The housing 310 may be disposedinside the cover 100. The housing 310 may be disposed between the cover100 and the bobbin 210. The housing 310 may be formed of a materialdifferent from that of the cover 100. The housing 310 may be formed ofan insulating material. The housing 310 may be formed of an injectionproduct. The outer side surface of the housing 310 may be spaced apartfrom the inner surface of the side plate 120 of the cover 100. Thehousing 310 may move for OIS driving through the spaced space betweenthe housing 310 and the cover 100. A first magnet 320 may be disposed inthe housing 310. The housing 310 and the first magnet 320 may be coupledby an adhesive. The first elastic member 510 may be coupled to the uppersurface of the housing 310. A second elastic member 520 may be coupledto the lower surface of the housing 310. The housing 310 may be coupledto the elastic member 500 by heat fusion and/or an adhesive. An adhesivefor coupling of the housing 310 and the first magnet 320, and thehousing 310 and the elastic member 500 may be an epoxy cured by at leastone of ultraviolet (UV), heat, and laser.

The housing 310 may comprise four side portions 310 a and four cornerportions 310 b disposed between the four side portions 310 a. The sideportion 310 a of the housing 310 may comprise a first side portion, asecond side portion disposed in the opposite side of the first sideportion, and a third side portion and a fourth side portion disposedopposite each other between the first side portion and the second sideportion. The corner portion 310 b of the housing 310 may comprise afirst corner portion disposed between the first side portion and thirdside portion, a second corner portion disposed between the first sideportion and fourth side portion, a third corner portion disposed betweenthe second side portion and the third side portion, and a fourth cornerportion disposed between the second side portion and the fourth sideportion. The side portion 310 a of the housing 310 may comprise a ‘sidewall’.

The housing 310 may comprise a hole 311. The hole 311 may be formed inthe housing 310. The hole 311 may be formed to penetrate the housing 310in the optical axis direction. A bobbin 210 may be disposed in the hole311. The hole 311 may be formed in a shape corresponding to the bobbin210 at least in portion. An inner circumferential surface or an innerside surface of the housing 310 forming the hole 311 may be positionedto be spaced apart from the outer circumferential surface of the bobbin210. However, the housing 310 and the bobbin 210 are overlapped witheach other at least in portion in the optical axis direction to limitthe moving stroke distance of the bobbin 210 in the optical axisdirection.

The housing 310 may comprise a driving part coupling part 312. The firstmagnet 320 may be coupled to the driving part coupling part 312. Thedriving part coupling part 312 may comprise a groove formed by recessinga portion of the inner circumferential surface and/or the lower surfaceof the housing 310. The driving part coupling part 312 may be formed oneach of the four side portions 310 a of the housing 310. As a modifiedembodiment, the driving part coupling part 312 may be formed in each ofthe four corner parts 310 b of the housing 310.

The second mover 300 may comprise a first magnet 320. The first magnet320 may be disposed in the housing 310. The first magnet 320 may befixed to the housing 310 by an adhesive. The first magnet 320 may bedisposed between the bobbin 210 and the housing 310. The first magnet320 may face the third coil 220. The first magnet 320 mayelectromagnetically interact with the third coil 220. The first magnet320 may face the first coil 422. The first magnet 320 mayelectromagnetically interact with the first coil 422. The first magnet320 may be commonly used for AF driving and OIS driving. The firstmagnet 320 may be disposed on the side portion 310 a of the housing 310.At this time, the first magnet 320 may be a flat magnet having a flatplate shape. As a modified embodiment, the first magnet 320 may bedisposed at a corner of the housing 310. At this time, the first magnet320 may be a corner magnet having a hexahedral shape whose inner sidesurface is wider than the outer side surface.

The lens driving device may comprise a stator 400. The stator 400 may bedisposed on one side of the movers 200 and 300. The stator 400 may bedisposed under the movers 200 and 300. The stator 400 may movablysupport the second mover 300. The stator 400 may move the second mover300. At this time, the first mover 200 may also move together with thesecond mover 300.

The stator 400 may comprise a substrate 410. The substrate 410 maycomprise a circuit member 420. However, the substrate 410 may bedescribed as a separate member as the circuit member 420. The substrate410 may comprise a first coil 422 facing the first magnet 320. Thesubstrate 410 may be disposed on the base 430. The substrate 410 may bedisposed between the housing 310 and the base 430. The support member600 may be coupled to the substrate 410. The substrate 410 may supplypower to the first coil 422. The substrate 410 may be coupled to thecircuit member 420. The substrate 410 may be coupled to the first coil422. The substrate 410 may be coupled to the first substrate 20 disposedunder the base 430. The substrate 410 may comprise a flexible printedcircuit board (FPCB). The substrate 410 may be partially bent.

The substrate 410 may comprise a body portion 411. The substrate 410 maycomprise a hole 411 a formed in the body portion 411. The substrate 410may comprise a hole 411 a corresponding to a lens being coupled to thebobbin 210.

The substrate 410 may comprise a terminal portion 412. The terminalportion 412 may be extended downward from the body portion 411 of thesubstrate 410. The terminal portion 412 may be formed by bending aportion of the substrate 410. At least a portion of the terminal portion412 may be exposed toward the outside. The terminal portion 412 may becoupled to the first substrate 20 disposed under the base 430 bysoldering. The terminal portion 412 may be disposed on a terminalaccommodating portion 433 of the base 430. The terminal portion 412 maycomprise a plurality of terminals.

The stator 400 may comprise a circuit member 420. The circuit member 420may be disposed on the base 430. The circuit member 420 may be disposedon the substrate 410. The circuit member 420 may be disposed between thefirst magnet 320 and the base 430. Here, although the circuit member 420is described as a configuration separate from the substrate 410, thecircuit member 420 may be understood as a configuration comprised in thesubstrate 410.

The circuit member 420 may comprise a substrate portion 421. Thesubstrate portion 421 may comprise a ‘substrate’. The substrate portion421 may be an FPCB. The first coil 422 may be integrally formed on thesubstrate 421 as a fine pattern coil (FP coil). A hole through which thesupport member 600 passes may be formed in the substrate portion 421.The substrate portion 421 may comprise a hole 421 a. The hole 421 a ofthe substrate portion 421 may be disposed to correspond to the hole 411a of the substrate 410.

The circuit member 420 may comprise a first coil 422. The first coil 422may face the first magnet 320. The first coil 422 may face the firstmagnet 320. The first coil 422 may electromagnetically interact with thefirst magnet 320. In this case, when a current is supplied to the firstcoil 422 and a magnetic field is formed around the first coil 422, thefirst magnet 320 may move with respect to the first coil 422 by theelectromagnetic interaction between the first coil 422 and the firstmagnet 320. The first coil 422 may move the housing 310 and the bobbin210 in a direction perpendicular to the optical axis with respect to thebase 430 through electromagnetic interaction with the first magnet 320.The first coil 422 may be a fine pattern coil (FP coil) being formedintegrally on the substrate portion 421.

The stator 400 may comprise a base 430. The base 430 may be disposedunder the housing 310. The base 430 may be disposed under the substrate410. The substrate 410 may be disposed on the upper surface of the base430. The base 430 may be coupled to the cover 100. The base 430 may bedisposed on the first substrate 20.

The base 430 may comprise a hole 431. The hole 431 may be formed in thebase 430. The hole 431 may be formed to penetrate the base 430 in theoptical axis direction. A light passing through the lens module throughthe hole 431 may be incident on the image sensor 10. That is, the lightpassing through the lens module may pass through the hole 421 a of thecircuit member 420, the hole 411 a of the substrate 410, and the hole431 of the base 430 to be incident on the image sensor 10.

The base 430 may comprise a sensor coupling part 432. A second sensor900 may be disposed on the sensor coupling part 432. The sensor couplingpart 432 may accommodate at least a portion of the second sensor 900.The sensor coupling part 432 may comprise a groove formed by recessingthe upper surface of the base 430. The sensor coupling part 432 maycomprise two grooves. At this time, a second sensor 900 is disposed ineach of the two grooves to detect the movement of the first magnet 320in the X-axis direction and the Y-axis direction.

The base 430 may comprise a terminal accommodating portion 433. Theterminal portion 412 of the substrate 410 may be disposed in theterminal accommodating portion 433. The terminal accommodating portion433 may comprise a groove formed by recessing a portion of a sidesurface of the base 430. The width of the terminal accommodating portion433 may be formed to correspond to the width of the terminal portion 412of the substrate 410. The length of the terminal accommodating portion433 may be formed to correspond to the length of the terminal portion412 of the substrate 410. Or, since the length of the terminal portion412 of the substrate 410 is longer than the length of the terminalaccommodating portion 433, a portion of the terminal portion 412 may beprotruded under the base 430.

The base 430 may comprise a step portion 434. The step portion 434 maybe formed on the side surface of the base 430. The step portion 434 maybe formed around the outer circumferential surface of the base 430. Thestep portion 434 may be formed as a portion of the side surface of thebase 430 is protruded or recessed. The lower end of the side plate 120of the cover 100 may be disposed in the step portion 434.

The lens driving device may comprise an elastic member 500. The elasticmember 500 may connect the housing 310 and the bobbin 210. The elasticmember 500 may be coupled to the bobbin 210 and the housing 310. Theelastic member 500 may elastically support the bobbin 210. The elasticmember 500 may have elasticity at least in portion. The elastic member500 may movably support the bobbin 210. The elastic member 500 maysupport movement of the bobbin 210 during AF driving. At this time, theelastic member 500 may be referred to as an ‘AF support member’.

The elastic member 500 may comprise a first elastic member 510. Thefirst elastic member 510 may be coupled to an upper portion of thebobbin 210 and an upper portion of the housing 310. The first elasticmember 510 may be coupled to the upper surface of the bobbin 210. Thefirst elastic member 510 may be coupled to the upper surface of thehousing 310. The first elastic member 510 may be coupled to the supportmember 600. The first elastic member 510 may be formed of a platespring.

The first elastic member 510 may comprise 1-1 to 1-6 elastic members501, 502, 503, 504, 505, and 506 spaced apart from each other. The firstelastic member 510 may be used as a conductive line for supplyingelectricity to a first sensor 710. The first elastic member 510 maycomprise 1-1 to 1-4 elastic members 501, 502, 503, and 504 spaced apartfrom each other. Each of the 1-1 to 1-4 elastic members 501, 502, 503,and 504 may be coupled to the substrate 720 to which the first sensor710 is coupled. The first elastic member 510 and the substrate 720 maybe coupled by soldering. The first elastic member 510 may be used as aconductive line for supplying electricity to the third coil 220. Thefirst elastic member 510 may comprise a 1-5 elastic member 505 and a 1-6elastic member 506 spaced apart from each other. The 1-5 elastic member505 may be coupled to one end of the third coil 220, and a 1-6 elasticmember 506 may be coupled to the other end of the third coil 220. Thefirst elastic member 510 and the third coil 220 may be coupled bysoldering.

The first elastic member 510 may comprise an outer side portion 511. Theouter side portion 511 may be coupled to the housing 310. The outer sideportion 511 may be coupled to an upper surface of the housing 310. Theouter side portion 511 may comprise a hole or groove coupled to theprotrusion of the housing 310. The outer side portion 511 may be fixedto the housing 310 by an adhesive.

The first elastic member 510 may comprise an inner side portion 512. Theinner side portion 512 may be coupled to the bobbin 210. The inner sideportion 512 may be coupled to an upper surface of the bobbin 210. Theinner side portion 512 may comprise a hole or groove coupled to theprotrusion of the bobbin 210. The inner side portion 512 may be fixed tothe bobbin 210 by an adhesive.

The first elastic member 510 may comprise a connection part 513. Theconnection part 513 may connect the outer side portion 511 and the innerside portion 512. The connection part 513 may have elasticity. At thistime, the connection part 513 may be referred to as an ‘elastic part’.The connection part 513 may be formed by being bent two or more times.

The first elastic member 510 may comprise a coupling part 514. Thecoupling part 514 may be coupled to the support member 600. The couplingpart 514 may be coupled to the support member 600 by soldering. Thecoupling part 514 may comprise a hole or groove coupled to the supportmember 600. The coupling part 514 may be extended from the outer sideportion 511. The coupling part 514 may comprise a bent portion formed bybeing bent.

The elastic member 500 may comprise a second elastic member 520. Thesecond elastic member 520 may be disposed under the bobbin 210. Thesecond elastic member 520 may be coupled to the bobbin 210 and thehousing 310. The second elastic member 520 may be coupled to a lowersurface of the bobbin 210. The second elastic member 520 may be coupledto a lower surface of the housing 310. The second elastic member 520 maybe formed of a plate spring. The second elastic member 520 may beintegrally formed.

The second elastic member 520 may comprise an outer side portion 521.The outer side portion 521 may be coupled to the housing 310. The outerportion 521 may be coupled to the lower surface of the housing 310. Theouter side portion 521 may comprise a hole or groove coupled to theprotrusion of the housing 310. The outer side portion 521 may be fixedto the housing 310 by an adhesive.

The second elastic member 520 may comprise an inner side portion 522.The inner side portion 522 may be coupled to the bobbin 210. The innerside portion 522 may be coupled to the lower surface of the bobbin 210.The inner side portion 522 may comprise a hole or groove coupled to theprotrusion of the bobbin 210. The inner side portion 522 may be fixed tothe bobbin 210 by an adhesive.

The second elastic member 520 may comprise a connection part 523. Theconnection part 523 may connect the outer side portion 521 and the innerside portion 522. The connection part 523 may elastically connect theouter side portion 521 and the inner side portion 522. The connectionpart 523 may have elasticity. At this time, the connection part 523 maybe referred to as an ‘elastic part’. The connection part 523 may beformed by being bent two or more times.

The lens driving device may comprise a support member 600. The supportmember 600 may connect the movers 200 and 300 and the stator 400. Thesupport member 600 may be coupled to the first elastic member 510 andthe substrate 410. The support member 600 may be coupled to the firstelastic member 510 and the circuit member 420 of the substrate 410. Thesupport member 600 may movably support the housing 310. The supportmember 600 may elastically support the housing 310. The support member600 may have elasticity at least in portion. The support member 600 maysupport movement of the housing 310 and the bobbin 210 during OISdriving. At this time, the support member 600 may be referred to as an‘OIS support member’. The support member 600 may comprise an elasticmember. The support member 600 may be formed of a wire. As a modifiedembodiment, the support member 600 may be formed of a plate spring.

The support member 600 may comprise a plurality of wires. The supportmember 600 may comprise six wires spaced apart from each other. Thesupport member 600 may comprise first to sixth support portions 601,602, 603, 604, 605, and 606 spaced apart from each other. The first tosixth support portions 601, 602, 603, 604, 605, and 606 may be used asconductive lines inside the lens driving device. The first to sixthsupport portions 601, 602, 603, 604, 605, and 606 may be coupled to thesubstrate 410. The first support portion 601 may be coupled to the 1-1elastic member 501. The second support portion 602 may be coupled to the1-2 elastic member 502. The third support portion 603 may be coupled tothe 1-3 elastic member 503. The fourth support portion 604 may becoupled to the 1-4 elastic member 504. The fifth support portion 605 maybe coupled to the 1-5 elastic member 505. The sixth support portion 606may be coupled to the 1-6 elastic member 506.

The lens driving device may comprise a damper (not shown). The dampermay be disposed on the support member 600. The damper may be disposed onthe support member 600 and the housing 310. The damper may be disposedon the elastic member 500. The damper may be disposed on the elasticmember 500 and the bobbin and/or the elastic member 500 and the housing310. The damper may be disposed on the elastic member 500 and/or thesupport member 600 to prevent a resonance phenomenon that is occurringin the elastic member 500 and/or the support member 600.

The lens driving device may comprise a first sensor unit 700. The firstsensor unit 700 may be provided for auto focus feedback. The firstsensor unit 700 may detect movement of the bobbin 210 in the opticalaxis direction. The first sensor unit 700 may detect a movement amountof the bobbin 210 in the optical axis direction and provide it to thecontroller in real time.

The lens driving device may comprise a first sensor 710. The firstsensor 710 may be used for AF feedback driving. At this time, the firstsensor 710 may be referred to as an ‘AF feedback driving sensor’. Thefirst sensor 710 may be disposed in the housing 310. In a modifiedembodiment, the first sensor 710 may be disposed on the bobbin 210. Thefirst sensor 710 may detect the movement of the first mover 200. Thefirst sensor 710 may comprise a Hall sensor. At this time, the Hallsensor may sense the magnetic force of the third magnet 730 to detectmovement of the bobbin 210 and the lens. The detection value sensed bythe first sensor 710 may be used for AF feedback control.

The lens driving device may comprise a substrate 720. The substrate 720may be disposed in the housing 310. The substrate 720 may be coupled tothe first sensor 710. The substrate 720 may be electrically connected tothe first sensor 710. The substrate 720 may be coupled to the firstelastic member 510. The substrate 720 may comprise four terminalscoupled to the 1-1 to 1-4 elastic members 501, 502, 503, and 504. Thesubstrate 720 and the first elastic member 510 may be coupled bysoldering.

The lens driving device may comprise a third magnet 730. The thirdmagnet 730 may be a ‘sensing magnet’. The third magnet 730 may bedisposed on the bobbin 210. The third magnet 730 may be detected by thefirst sensor 710. The third magnet 730 may face the first sensor 710.The third magnet 730 may be disposed at the corner of the bobbin 210.That is, the third magnet 730 may be disposed to face the corner portion310 b of the housing 310.

The lens driving device may comprise a fourth magnet 800. The fourthmagnet 800 may be a ‘compensation magnet’. The fourth magnet 800 may bedisposed on the bobbin 210. The fourth magnet 800 may be disposed toachieve magnetic force equilibrium with the third magnet 730. The fourthmagnet 800 may be symmetrical with the third magnet 730 centered aboutthe optical axis. The fourth magnet 800 may be disposed at a positioncorresponding to the third magnet 730 centered about the optical axis.The fourth magnet 800 may have a size and/or shape corresponding to thethird magnet 730 centered about the optical axis. A third magnet 730 maybe disposed on one side of the bobbin 210 and a fourth magnet 800 may bedisposed on the other side of the bobbin 210. The fourth magnet 800 maybe disposed at the corner of the bobbin 210. That is, the fourth magnet800 may be disposed to face the corner portion 310 b of the housing 310.

The lens driving device may comprise a second sensor 900. The secondsensor 900 may be used for IS feedback control. At this time, the secondsensor 900 may be referred to as a “sensor for driving OIS feedback”.The second sensor 900 may be disposed between the base 430 and thesubstrate 410. The second sensor 900 may detect the movement of thesecond mover 300. The second sensor 900 may comprise a Hall sensor. Atthis time, the Hall sensor may sense the magnetic force of the firstmagnet 320 to detect movement of the housing 310 and the first magnet320. The detection value sensed by the second sensor 900 may be used forOIS feedback control.

Hereinafter, the operation of the camera device according to the presentembodiment will be described.

The auto focus function of the camera device according to the presentembodiment will be described. When a power is supplied to the third coil220 the third coil 220 moves with respect to the first magnet 320 due toelectromagnetic interaction between the third coil 220 and the firstmagnet 320. At this time, the bobbin 210 to which the third coil 220 iscoupled moves integrally with the third coil 220. That is, the bobbin210 to which the lens module is coupled moves in the optical axisdirection with respect to the housing 310. Since this movement of thebobbin 210 results in a movement of the lens module to be closer orfurther away from the image sensors 10 and 1010, in this embodiment,power is supplied to the third coil 220 so that the focus adjustment canbe performed on the subject. Meanwhile, the aforementioned focusadjustment may be automatically performed according to the distance ofthe subject.

In the camera device according to the present embodiment, auto focusfeedback control may be performed for a more precise implementation ofthe auto focus function. The first sensor 710 disposed in the housing310 senses the magnetic field of the third magnet 730 disposed in thebobbin 210. Therefore, when the bobbin 210 performs relative movementwith respect to the housing 310 the amount of the magnetic field sensedby the first sensor 710 changes. In this way, the first sensor 710detects the amount of movement of the bobbin 210 in the optical axisdirection or the position of the bobbin 210 and transmits the detectedvalue to the controller. The controller determines whether to performadditional movement of the bobbin 210 based on the received detectionvalue. Since such a process occurs in real time, the auto focus functionof the camera device according to the present embodiment can beperformed more precisely through the auto focus feedback control.

An image stabilization function of the camera device according to thepresent embodiment will be described. When power is supplied to thefirst coil 422 the first magnet 320 moves with respect to the first coil422 due to electromagnetic interaction between the first coil 422 andthe first magnet 320. At this time, the housing 310 to which the firstmagnet 320 is coupled moves integrally with the first magnet 320. Thatis, the housing 310 moves in a horizontal direction (a directionperpendicular to the optical axis) with respect to the base 430.However, at this time, a tilt of the housing 310 may be induced withrespect to the base 430. Meanwhile, the bobbin 210 moves integrally withthe housing 310 with respect to the horizontal movement of the housing310. Therefore, such movement of the housing 310 results in a lensmodule coupled to the bobbin 210 with respect to the image sensors 10and 1010 to be moved in a direction parallel to the direction in whichthe image sensors 10 and 1010 are placed. That is, in the presentembodiment, the image stabilization function can be performed bysupplying power to the first coil 422.

In the camera device according to the present embodiment, imagestabilization feedback control may be performed in order to moreaccurately realize the image stabilization function. The second sensor900 disposed on the base 430 senses the magnetic field of the firstmagnet 320 disposed on the housing 310. Therefore, when the housing 310moves with respect to the base 430 the amount of the magnetic fielddetected by the second sensor 900 is changed. A pair of second sensors900 detects the movement amount or position of the housing 310 in thehorizontal direction (x-axis and y-axis directions) in this way andtransmits the detected value to the controller. The controllerdetermines whether to perform additional movement of the housing 310based on the received detection value. Since such a process occurs inreal time, the image stabilization function of the camera deviceaccording to the present embodiment can be performed more preciselythrough image stabilization feedback control.

In the above description, all components constituting the embodiments ofthe present invention are described as being combined or operating incombination, but the present invention is not necessarily limited to theembodiments. In other words, within the scope of the purpose of thisinvention, all of those components may operate in selective combinationsof one or more components. In addition, the term “comprise”, “comprise”,or “have” described above means that the corresponding components can beembedded unless there is an opposite description therefore it should beinterpreted that other components may further be comprised in additionto those corresponding components. All terms, comprising technical andscientific terms, have the same meaning as commonly understood by one ofordinary skill in the art to which this invention belongs, unlessotherwise defined. Commonly used terms, such as predefined terms, shouldbe interpreted to be consistent with the contextual meanings of therelated art, and are not to be construed as ideal or excessivelyformalistic, unless expressly defined to the contrary.

The above description is only to those described as the technical ideaof the present invention by way of an example, and those skilled in theart will appreciate that various modifications and variations can bemade without departing from the essential features of the presentinvention. Therefore, the embodiments disclosed in the present inventionare not intended to limit the technical idea of the present inventionbut to describe the present invention, and the scope of the technicalidea of the present invention is not limited by these embodiments. Theprotection scope of the present invention should be interpreted by thefollowing claims, and all technical ideas within the equivalent scopeshould be interpreted as being comprised in the scope of the presentinvention.

1. A camera device comprising: a first substrate; a second substratedisposed on the first substrate; an image sensor configured to movetogether with the second substrate; a first coil and a first magnetconfigured to move the second substrate by an interaction; a lensdisposed on the image sensor; and a third substrate connecting the firstsubstrate and the second substrate, wherein the image sensor moves in adirection perpendicular to an optical axis direction with respect to thelens by the interaction between the first coil and the first magnet,wherein the third substrate electrically connects the image sensor andthe first substrate, and wherein the third substrate comprises aflexible printed circuit board configured to movably support the secondsubstrate with respect to the first substrate.
 2. The camera device ofclaim 1, comprising a second coil and a second magnet configured to movethe lens in the optical axis direction.
 3. The camera device of claim 1,wherein each of the first substrate and the second substrate is a rigidprinted circuit board.
 4. The camera device of claim 1, wherein an uppersurface of the image sensor faces the lens, and wherein the uppersurface of the image sensor is disposed lower than an upper surface ofthe second substrate.
 5. The camera device of claim 1, wherein the imagesensor is not overlapped with the second substrate in the directionperpendicular to the optical axis direction.
 6. The camera device ofclaim 1, wherein a thickness of the second substrate is greater than athickness of the third substrate.
 7. The camera device of claim 1,wherein the third substrate is connected to an outer lateral surface ofthe second substrate.
 8. The camera device of claim 1, wherein the thirdsubstrate comprises a bent part.
 9. The camera device of claim 1,wherein the first magnet is overlapped with the first coil in theoptical axis direction.
 10. The camera device of claim 1, wherein thefirst magnet is disposed upper than the first coil.
 11. The cameradevice of claim 1, wherein the second substrate comprises a couplingpart coupled to the image sensor, and an extension part extendingoutwardly from the coupling part, wherein at least a portion of theextension part of the second substrate is overlapped with the firstsubstrate in the optical axis direction, and wherein a ball is disposedbetween the first substrate and the extension part of the secondsubstrate.
 12. The camera device of claim 1, wherein the first substratecomprises a groove formed on an upper surface of the first substrate,and wherein the ball is disposed on the groove of the first substrate.13. The camera device of claim 11, wherein the first coil is overlappedwith the ball in the optical axis direction.
 14. The camera device ofclaim 1, wherein the first coil is disposed on the first substrate, andwherein the first magnet is disposed on the second substrate and facingthe first coil.
 15. An optical instrument comprising: a main body; thecamera device of claim 1 disposed on the main body; and a displaydisposed on the main body and outputting an image photographed by thecamera device.
 16. A camera device comprising: a first substrate; asecond substrate disposed on the first substrate; an image sensordisposed on the second substrate; a first coil and a first magnetconfigured to move the second substrate and the image sensor; a lensdisposed on the image sensor; and a third substrate electricallyconnecting the first substrate and the image sensor, wherein the imagesensor moves in a direction perpendicular to an optical axis directionwith respect to the lens, and wherein the third substrate comprises aflexible printed circuit board.
 17. The camera device of claim 16,comprising a second coil and a second magnet configured to move the lensin the optical axis direction.
 18. The camera device of claim 16,wherein each of the first substrate and the second substrate is a rigidprinted circuit board.
 19. The camera device of claim 16, wherein anupper surface of the image sensor faces the lens, and wherein the uppersurface of the image sensor is disposed lower than an upper surface ofthe second substrate.
 20. A camera device comprising: a first substrate;a second substrate disposed on the first substrate; an image sensordisposed on the second substrate; a first coil and a first magnetconfigured to move the second substrate by an interaction; and a lensdisposed on the image sensor.